Home > Services > Testing > Mechanical
 

Mechanical & Metallurgical Testing

  • Field Emission Scanning Electron Microsope(FESEM)

    It is an advanced analytical microscopy technique that can be used to resolve and analysenanosize structures to provide topographic, morphological and elemental composition at the surface of a sample.

    Applications:

    1.High resolution imaging for both conductive and non-conductive samples even without any conductive coating applied.
    2.Resolves nanostructure surface detail on both conductive and non-conductive samples.
    3.Measures size of particles on non-conductive fillers based on image.
    4.Identifies elements present on unknown/foreign material.
    5.Provides elemental composition of metallic materials.

          (Note: Elements with atomic number less than 11 cannot be quantified.)
     


 

  • Tensile, compression, shear, flexural/bend and torque test
  • Charpy impact test
  • Hardness test (Rockwell, Brinell, Vickers)
  • Welding procedure & welder qualification test (ASME, API, AWS, CAAS)
  • Bond strength test/Lap shear test
  • Customised load test
  • Cyclic / fatigue test
  • Fracture toughness (CTOD, KIC)
  • Pressure / hydrostatic test
  • On-site pull-out & shear test of cast-in component (Bolt, Channel)
  • Materials tested:
    o     Metallic, Polymeric, Composite, Ceramic
  • Product/ Component tested:
    o     Rebar, Wire Mesh, Steel Wire, Metalform
    o     Fasteners (Bolt, Nut, Screw)
    o     Scaffold System (Frame and Modular) and Components
    o     Spring / Shock Absorber
    o     Packaging Product / Pallet
    o     Bar, Beam, Piping, Valve, Fitting and Structure
  • Microstructural evaluation of steel, nickel alloy, copper alloy, aluminium alloy, tin/lead, zinc alloy, magnesium alloy, titaniumalloy, powder metallurgy materials, etc
  • Macro-examination of welds
  • Grain size measurement
  • Determination of case depth/decarburisation depth
  • Determination of inclusion contents in steel
  • Coating / plating thickness measurement
  • Debris (solid particles) identification
  • Ferrite count (duplex stainless steel)
  • Micro-hardness test
  • On-site portable hardness test
  • In-situ metallography (replica)
  • Evaluation of thermal spray coatings
  • Cross section examination of PCB components
  • Intergranular corrosion test
  • General corrosion test